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The Aluminum Nitride (AlN) Therma-Bridge is a simple, cost effective device which aids in thermal management. Bridges are available in standard sizes and thicknesses. Custom sizes are also available on request. The Therma-Bridge is designed to transport heat from one location to another. Simply attach one terminal to the heat source, and the other terminal to a thermal plane or heat sink. Popular application configurations are shown below. The Therma-Bridge has the following features:

  • Very high thermal dissipation
  • Protection of crucial board components from heat
  • Optimal control over board temperature
B-Series Therma-Bridge
Compact Thermal Management Device
Application Examples
Thermal Dissipation
The table below lists the thermal resistance (in black) measured in degrees C per watt
(°C/W) and the equivalent thermal conductivity, normalized to chip size, (in red) measured in milliwatts per degree C (mW/°C) for each Therma-Bridge size and thickness combination.

These values are based on the nominal thermal resistance of Aluminum Nitride. The values are approximate.

The values are calculated using material constants, the area of each chip face (x•y) and the thickness (d) of each device.
Data Sheet
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2007 International Manufacturing Services, Inc.